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A facile method for the preparation of electrically conducting polypyrrole nanoparticles and their nanocomposites with single‐walled and multi‐walled carbon nanotubes was developed. The polypyrrole nanoparticle size and conductivity varied as a function of reaction time with an average size of 143–195 nm and a conductivity of 0.43–0.82 S cm−1. The change in the electronic properties of the conducting...
Anthocyanin extract of orchid flower, Dendrobium Sonia ‘Red Bom’, (DSAE) showed multiple color variation as pH of the solutions varied. It gave red, violet, blue, green, and yellow at pH 2–11.0. Discoloration of the solution was observed in the pH range of 4–6. The red (pH 3) and violet solutions (pH 7.0) of DSAE were found to be most stable and did not produce brown precipitate on storage for at...
This paper reports the kinetics of thermal degradation of Dendrobium Sonia ‘Red Bom’ anthocyanins extract (DSAE) containing the red flavylium cations of anthocyanins. The stability of DSAE was studied at different temperatures for different periods of storage by measuring the absorbance at the wavelength of maximum absorption in the visible light region. The thermal degradation profiles at all temperatures...
Transurethral ultrasound (TUUS) may improve prostate imaging by providing real-time volumetric imagery from directly within the prostate. A transurethral ultrasound transducer prototype was developed that features a cylindrical 2D array of piezoelectric elements that can be integrated with a catheter body. Fabrication of the transducer was made possible with a microfabrication process that allows...
We fabricated 1.3mum TM mode LD with integrated SSC. The high polarization ratio of 21dB was obtained between TM and TE mode. SSC supplied good coupling efficiency and alignment tolerance with LR-SPP waveguide. Clear eye opening was observed under 10Gbps NRZ modulation.
During the die bonding process of large IC-chips (say 300mil or above), the application of complex "epoxy writing pattern" are usually needed as to enhance the evenness of epoxy distribution (or the so-called epoxy "spread-out") along the peripheral of the die. In order to obtain a nice epoxy "build-up" or "fillet-height" along the peripheral of the die, and...
Polymer flip chip process utilizes Ag filled thermoset and/or thermoplastic polymers, in combination with stencil printing processes to form polymer bump interconnects of flip chip IC devices (Estes, 1998). Nevertheless, slumping behavior of conventional polymer interconnect material during bumping process on the wafer chip has constrained the bump height achieved by the most common stencil printing...
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