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To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabling...
The advancement of silicon scaling to 14/16 nanometer (nm) in support of higher performance, higher bandwidth and lower power consumption in portable and mobile devices is pushing the boundaries of emerging packaging technologies to smaller fan-out packaging designs with finer line/spacing as well as improved electrical performance and passive embedded technology capabilities. Advanced embedded Wafer...
Along with the prevalence of distributed systems, more and more applications require the ability of reliably transferring messages across a network. However, passing messages in a convenient and dependable way is both difficult and error prone. Thus the existing messaging products usually suffer from numerous software bugs. And these bugs are particularly difficult to be diagnosed or avoided. Therefore,...
Current reputation systems for peer-to-peer (P2P) file sharing networks suffer from high overhead on reputation querying. Also, purely relying on a threshold to detect malicious nodes may make a high-reputed node be reluctant to further increase its reputation in these reputation systems. On the other side, the social network concept of ”friendship foster cooperation” can be utilized to alleviate...
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products and pressure of cost reduction. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed...
In current reputation systems for peer-to-peer (P2P) file sharing networks, reputation querying generates high overhead in file service. Also, a high-reputed node may be reluctant to further increase its reputation in these reputation systems. Recently, social network-based P2P systems that favor file sharing among friends have been proposed for reliable file sharing. However, this approach contradicts...
The purpose of this research is to develop the usage intention model of online e-learning systems. Based on the Technology Acceptance Model and D&M model, the proposed framework is validated with 285 respondents from online e-learning users in Taiwan, which shows that information quality, service quality, perceived ease of use and perceived usefulness are play an critical role to determine user...
This purpose of the study is to develop the usage intention model of Telecare systems. Based on the Technology Acceptance Model, the proposed framework is validated with 365 respondents from Nantou County located in Taiwan, which shows that both perceived ease of use, and perceived usefulness are key factors affecting the intention to use telecare system. According to the statistical results, the...
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