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The advancement of silicon scaling to 14/16 nanometer (nm) in support of higher performance, higher bandwidth and lower power consumption in portable and mobile devices is pushing the boundaries of emerging packaging technologies to smaller fan-out packaging designs with finer line/spacing as well as improved electrical performance and passive embedded technology capabilities. Advanced embedded Wafer...
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products and pressure of cost reduction. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed...
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