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Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the...
High density indium bump bonding is in high demand for devices which operate under cryogenic environments, such as pixellated X-ray detectors for high energy physics, due to the outstanding ductility of indium even at liquid helium temperatures. For these assembly applications, the connection pitch size is shifting to below 50 mum, such that the packaging density, i.e. I/Os, may exceed 40,000/cm2...
Indium bump bonding has been employed to realize very high density interconnection used for hybrid pixel detector systems. The connection pitch sizes to achieve this may be below 50 mum for these assembly applications, such that the packaging density, i.e. I/Os, may exceed 40,000/cm2. Electrodeposition is a promising approach to enable a low- cost and high yield bump bonding process, compared with...
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