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The impacts of thermal annealing on the interfacial reactions and bonding structures between the tungsten metal gate and CeO2/La2O3 stacked dielectrics were investigated by x-ray photoelectron spectroscopy (XPS) measurements. We found that the amount of W oxidation increases with the depth closer to the CeO2 layer. In addition, as the annealing temperature increases to 600 °C, out-diffusion of Ce...
Effects of thermal annealing on the interface reactions and the bonding structures of several CeO2/La2O3 stacked dielectrics were studied in detail based on x-ray photoelectron spectroscopy (XPS) measurements. Results indicated that the high-temperature annealing can enhance O, Ce, La, and Si diffusion and result in the intermixing of CeO2/La2O3 stack, growth of interfacial silicates layer at the...
The effects of thermal annealing on the interface reactions and bonding structures of CeO2/La2O3 stacked dielectrics are investigated by x-ray photoelectron spectroscopy (XPS) measurements. We found that the thermal treatment can lead to significant interface oxidation and silicate formation both in the bulk and at the interface. Sample with 600 °C annealing exhibits some better interface properties...
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