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A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113...
Immersion solder bumping, a mask-less and low cost processing, brings feasibility to the ultra-fine pitch chip-to- chip interconnection; however, how to make the uniform micro-bump is still a great challenge. In this paper, the uniform micro-bumps with very thin Sn-3.0Ag-0.5Cu (SAC305) solder layer on electroless nickel under bump metallization (UBM) are achieved. The test chips we used have 6,507...
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