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In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of molding compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy molding compound, the release force can be kept at same level with less wax content which can...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
The delamination of epoxy molding compound (EMC) on T0252 after JEDEC level 3 and 260c reflow was studied from 3 factors as epoxy resin, phenol hardeners, and filler content. It indicated that when the epoxy resin is mixed of biphenyl and EOCN type, phenol resin is the new type with the structure as Fig.l, filler content as 84%, the resulting epoxy molding compound exhibited the same performance as...
Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally from coefficient of thermal expansion mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to...
Surface chemistry and surface energy of copper leadframe after thermal treatment at 175C were studied by XPS and contact angle. The adhesion after JEDEC level 3 and reflow between epoxy molding compound and leadframe after thermal treatment was measured too. The results shows that the adhesion between epoxy molding compound and heated lead frame increased with heat the leadframe up to 3 minutes then...
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