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This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization...
This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 µm CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700...
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