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Advanced packaging and heterogeneous integration are major drivers for future electronic systems. Examples include 3D-IC, wafer level packaging, embedded components, and system in package. To realize the benefits of advanced packaging and heterogeneous systems integration, design flows, circuit-level simulations, and physics-based modelling will need to address the challenges for chip-package-system...
The impact of conformal coating penetration on the solder joints' thermal fatigue reliability in QFNs was studied using computational modeling techniques. 3D finite element models were developed with consideration of realistic solder joint shape and the actual coating profile. Thermal mechanical simulations were carried out for three cycles under accelerated thermal test conditions of −25 to 100°C,...
This paper details the current status and future requirements of modelling and simulation tools in supporting chip, package, and board level co-design for advanced packaging (3D-IC's with TSV's, WLP, SiP, etc.) of heterogeneous integrated systems. These tools will drive innovations across the die-package-system domains by optimizing electrical, thermal, mechanical and reliability performance for a...
3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities...
3D printing offers the possibility to fabricate parts and products in a cost-effective, high-throughput, mass-customisation and energy efficient manner across a diverse range of applications. This paper details the key challenges in adopting 3D printing in electronics manufacturing and sets the design and modelling approaches best suited to carry out assessment and optimisation of performance, quality...
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