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Lamb wave scattering in an infinite, isotropic, homogeneous and linear elastic plate which contains a pair of surface-breaking inclined notch is evaluated. An inclined crack can be approached by vanishing the width of the inclined notch. The scattering of Lamb waves from geometric discontinuities involves all these wave modes which contain a finite number of propagating modes having real wave-numbers,...
Valve side lead exit is a key important part of converter transformer, by which bushing terminal connects with the transformer valve winding. Valve side lead exit consists of bushing terminal and surrounding barrier system, and it is usually installed in the bushing ascending flange where resin impregnated paper (RIP), oil impregnated paper (OIP) and transformer oil co-exist in the compact place....
This study focuses on the development of a highly reliable solder bumping solution by the optimization of bump height and shape for flip-chip mounting of large die directly on PCB without the use of underfill. To achieve the goal, an elongated solder joint with an optimized shape has been developed that demonstrated far superior board-level thermo-mechanical reliability to that of the conventional...
Finite element method was used to compute the thermo-elasto-plastic stress and strain fields of turbine blade according to typical loading spectrum. Controlled-strain test of turbine blade material was carried to get some necessary parameters used in life prediction formulas. On the basis of the above analysis, fatigue life of gas turbine blade was estimated.
The fan-out-type chip scale package (fan-out CSP) is an embedded chip packaging technology that eliminates the need for wirebonds and flip-chip bumps. In this study, the board-level reliability of fan-out CSP is studied by using three-dimensional finite element analysis. A design of simulations study is applied to investigate the influences of package geometry on the board-level interconnect reliability...
The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermo-mechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of...
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