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The demand of electronic device applications for high performance, minimization and cost effectiveness has driven the highly integrated semiconductor packaging development in recent years. Embedding die technology, which reduces package height and weight, increases the functionality and density, improves electrical and thermal performance and reduces the cost effectively, is particularly attractive...
For the last few decades semiconductor industry has been following Moore Law effectively, which has resulted in significant miniaturization of transistors and chip logic circuitry, and the development of 3D integration technology. While due to the large size and extremely thin of chip and interposer, increasingly attention has been payed to the warpage, which was regarded not only decide the assembly...
This paper presents signal integrity analysis of a high-performance processor package with silicon interposer. Thediewas attached on the top side of the siliconinterposer with through silicon vias (TSVs), and theinterposer was connected to the organic substrate. The signal transmission path of this package consists of two redistribution layers (RDLs), TSVson interposer, and wirings on the substrate...
This paper presents signal integrity analysis of a high-performance processor package with silicon interposer. Thediewas attached on the top side of the siliconinterposer with through silicon vias (TSVs), and theinterposer was connected to the organic substrate. The signal transmission path of this package consists of two redistribution layers (RDLs), TSVson interposer, and wirings on the substrate...
TSV (Through Silicon Via) is regarded as the key enabling technology for 2.5D and 3D IC packaging solution. Si interposers with TSV have emerged as an excellent solution providing high wiring density interconnection, minimizing CTE mismatch to the Cu/low-k chip that is vulnerable to thermo-mechanical stresses, improving electrical performance and decreasing power consumption due to shorter interconnection...
Laminar sheath gas is introduced into the Electrohydrodynamic Direct-Write (EDW) to promote the stability of charged jet and deposition precision of printed micro/nano structure. A novel EDW spinneret with sheath gas is designed to fabricate fine 1D micro/nano structure under lower applied voltage. The laminar sheath gas restricts the whipping motion of charged jet as well as decreases the required...
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