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Three dimensional electronic packages have been extensively investigated to meet the ever increasing needs for size reduction and performance improvement of electronic devices. To overcome the disadvantages of conventional wire bonding in 3D packages, through-silicon-vias (TSVs) filled with Cu has been proposed as a new chip-to-chip vertical interconnection. In addition, TSVs can be also used as thermal...
We examined the resistance-change behavior of thin Pt and Au films on the PDMS elastomeric substrate. A maximum Young's modulus of 1.74 MPa was obtained for the PDMS substrate by adjusting the mixing ratio between base polymer and its curing agent to 10:1. Parylene coating on the PDMS surface was effective as an adhesion layer between metal interconnects and PDMS substrate. Without a Parylene coating,...
Combat modeling is a key area of military science and related research. Here, we propose a moment matching scheme with a modified stochastic Lanchester-type model. An experiment shows that the proposed scheme makes approximations more rapidly while maintaining a high level of accuracy compare to the Markovian model.
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