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Power delivery network (PDN) design is one of the most critical challenges in 3D Integrated Circuits (IC) design. In existing studies, to ensure the robustness of the 3D PDN, the number of TSVs was always increased inefficiently to mitigate the IR-drop and power noise. However, the overhead for connections is a crucial obstacle to the development of 3D ICs. Consequently, an efficient TSV topology...
Due to the high integration on vertical stacked layers, power/ground network design becomes one of the critical challenges in 3D IC design. With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Power/ground (P/G) TSVs can help to relieve the IR drop violation by vertically...
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