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Vias are typical discontinuities for high-speed signal transmission in printed circuit boards. Previous work has studied the through-hole via connections from the top layer to the bottom between microstrip traces and proposed an equivalent transmission-line model for impedance matching between traces and vias. In this paper, the equivalent transmission-line model is extended for the via structures...
Widespread use of the Web 2.0 Internet applications such as video streaming and social networking are continuously demanding higher bandwidth network equipment. Electrical designers increasingly face more and more challenges to deliver higher speed products within short development cycle due to design complexity and new multi-GHz signal integrity problems. This paper presents a modeling and simulation...
This paper presents the design of serial chip-to-chip communication at 20 Gbps including modeling and correlation for PCBs (Printed Circuit Boards) with FR4 substrate materials. The entire channel under investigation includes two packages, a 21-layer ceramic and a 12-layer organic, and a 22-layer PCB. A probing station, microprobes and a VNA are used to measure the entire channel S-parameters and...
Vias are widely modeled and investigated as they are one of the most concerns for the critical signal nets in high-speed digital systems. 3-D full-wave modelling can predict the electrical performance of a via accurately with correct model settings, which are related to the understood of the physics behind the signal transition and the wave propagation associated with the via. This paper will detail...
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential...
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