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High performance ASICs (Application-Specific Integrated Circuits) are getting dominant in modern high-end networking systems. Provisions on the power supplies for these extremely high integrated ASICs are somewhat demanding and strict especially for sensitive analog power rails. To meet the power requirements from ASIC vendors, ferrite bead is used to fulfil the analog filtering. In order to complete...
The study on dynamic response of CFRD is presented using 50g-t centrifuge shaking table in Tsinghua university subjected to sine wave and Parkfield earthquake wave. The experiment is conducted under the 50g condition. Acceleration time histories are recorded by acceleration transducer at different locations on the model and the deformation of the face-slab is also measured. The vibration response...
Vias are typical discontinuities for high-speed signal transmission in printed circuit boards. Previous work has studied the through-hole via connections from the top layer to the bottom between microstrip traces and proposed an equivalent transmission-line model for impedance matching between traces and vias. In this paper, the equivalent transmission-line model is extended for the via structures...
Widespread use of the Web 2.0 Internet applications such as video streaming and social networking are continuously demanding higher bandwidth network equipment. Electrical designers increasingly face more and more challenges to deliver higher speed products within short development cycle due to design complexity and new multi-GHz signal integrity problems. This paper presents a modeling and simulation...
This paper presents the design of serial chip-to-chip communication at 20 Gbps including modeling and correlation for PCBs (Printed Circuit Boards) with FR4 substrate materials. The entire channel under investigation includes two packages, a 21-layer ceramic and a 12-layer organic, and a 22-layer PCB. A probing station, microprobes and a VNA are used to measure the entire channel S-parameters and...
Frequency-dependent causal RLGC(f) models are proposed for single-ended and coupled transmission lines. Dielectric loss, dielectric dispersion, and skin-effect loss are taken into account. The dielectric substrate is described by the two-term Debye frequency dependence, and the transmission line conductors are of finite conductivity. In this paper, three frequency-dependent RLGC models are studied...
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential...
A method for developing a causal RLGC model from S-parameter measurements is proposed for single-ended transmission lines with the assumption of 2nd order Debye representation for the substrate dielectric medium. Genetic algorithm, an optimization method, is used to find the causal model parameters and the substrate dielectric properties. The measured S-parameter of a stripline with TRL calibration...
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of...
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