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Widespread use of the Web 2.0 Internet applications such as video streaming and social networking are continuously demanding higher bandwidth network equipment. Electrical designers increasingly face more and more challenges to deliver higher speed products within short development cycle due to design complexity and new multi-GHz signal integrity problems. This paper presents a modeling and simulation...
This paper presents the design of serial chip-to-chip communication at 20 Gbps including modeling and correlation for PCBs (Printed Circuit Boards) with FR4 substrate materials. The entire channel under investigation includes two packages, a 21-layer ceramic and a 12-layer organic, and a 22-layer PCB. A probing station, microprobes and a VNA are used to measure the entire channel S-parameters and...
Frequency-dependent causal RLGC(f) models are proposed for single-ended and coupled transmission lines. Dielectric loss, dielectric dispersion, and skin-effect loss are taken into account. The dielectric substrate is described by the two-term Debye frequency dependence, and the transmission line conductors are of finite conductivity. In this paper, three frequency-dependent RLGC models are studied...
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential...
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