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The electrical performance of vias in multilayer PCBs is investigated. In particular the resonance effect due to overlapping anti-pads is characterized and an analytical formulation based on the dimensions of the cavity formed by the anti-pads and the vias is used to predict such a resonance. A prototype board is fabricated and measured results confirm the predicted results obtained from 3D electromagnetic...
Breathing is an involuntary action by the human body, and irregularities in breathing suggests possible respiratory disorders. Respiratory rate is an important parameter for breath sound analysis, and many papers have been published on how respiratory rate can be measured accurately and non-invasively. However, relatively fewer papers deal with breath sound based respiratory rate estimation. This...
High performance ASICs (Application-Specific Integrated Circuits) are getting dominant in modern high-end networking systems. Provisions on the power supplies for these extremely high integrated ASICs are somewhat demanding and strict especially for sensitive analog power rails. To meet the power requirements from ASIC vendors, ferrite bead is used to fulfil the analog filtering. In order to complete...
SFP (Small Form-factor Pluggable) module and SFP cage form an interface between a network device and an optic cable or a copper cable for data communication and telecommunication. Data rate on such an interface for a high-speed channel varies from 1 Gbps (Gigabit per second) to 10 Gbps for the existing products, and products with the data rate of 16 Gbps are under development. Due to the differences...
Vias are typical discontinuities for high-speed signal transmission in printed circuit boards. Previous work has studied the through-hole via connections from the top layer to the bottom between microstrip traces and proposed an equivalent transmission-line model for impedance matching between traces and vias. In this paper, the equivalent transmission-line model is extended for the via structures...
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential...
An effective method for extracting parameters of a Debye or a Lorentzian dispersive medium over a wideband frequency range using a genetic algorithm (GA) and a transmission-line model is presented. Scattering parameters (S-parameters) of the transmission-line sections, including a parallel plate, microstrip, and stripline, are measured. Wave equations for TEM/quasi-TEM mode with a complex propagation...
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