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RF interference can be a significant problem in modern day electronic devices. We present a workflow for the simulation of RF interference using a combination of 3D full-wave simulation and a system-level approach. This methodology helps reveal the transmitter and receiver combinations that are potentially prone to interference. The utilization of time domain results generated from SPICE-type circuit...
Simulation of bioelectromagnetic problems can be complex, necessitating analysis and benchmarking of the various simulation solutions. Use of different numerical approaches to solve the same problems allows verification of the simulation results.
The goal of this work is to electrically model TSVs and 3D interposer interconnects by means of three dimensional (3D) full wave electromagnetic simulations and a circuit like approach for a very fast simulation. The full wave simulations provide a comprehensive and systematic analysis of various parameters of the structure. The circuit like approach provides an analysis opportunity to determine some...
All electronic devices must meet electromagnetic compatibility (EMC) standards to ensure safe and reliable operations. Using simulations to investigate possible EMC issues during the design stage can be used to quickly identify possible issues. Realistic simulations may however result in very large scale problems, especially if one wants to include all possible environment effects. This article describes...
Passive channels pose significant challenges to the serial link transmission for single-ended buses running at very high speed. This paper will cover different aspects of the challenges in modeling chips, packages, PCB's, connectors and their interactions. The goal of the paper is to show full 3D link as well as hybrid 2D/3D link correlation for both passive (TDR/VNA) and active (system margins) measurements...
3D IC based systems necessitate a chip-package co-design approach since the TSV response in the chip stack can propagate into the package. In this work, we demonstrate a chip-interposer co-analysis methodology that includes the 3D CAD model of the 3D IC and compare this to the conventional analysis techniques. Our findings demonstrate that the coupling between signal TSV's in the chip stack has a...
The electrical performance of vias in multilayer PCBs is investigated. In particular the resonance effect due to overlapping anti-pads is characterized and an analytical formulation based on the dimensions of the cavity formed by the anti-pads and the vias is used to predict such a resonance. A prototype board is fabricated and measured results confirm the predicted results obtained from 3D electromagnetic...
The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula is presented for the prediction of such resonant frequencies. Sensitivity analyses are also performed in order to investigate the impact of the solder...
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