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Due to the windings of zero sequence filter are linked with zigzag connection, the zero sequence leakage reactance is the key parameter that affects the effect of the zero sequence filter. The simulation of two-dimensional leakage magnetic field in one phase of 100kVA zero sequence filter were implemented by using finite element analysis software-ANSYS, through pre-processing, solving and post-processing,...
Established embedded substrate microscale ball grid array solder three point bending stress and strain finite element analysis model, analyzed the solder joint materials, spot diameter and the influence of the bending stress and strain of solder pad diameter, the results show that the torque load, the embedded type substrate microscale BGA solder joint array of maximum stress and strain are occurred...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
A multi-physics multi-scale modeling platform has been developed and it has been applied to various stages of the LED manufacturing such as MOCVD reactor design, epitaxial growth based on silicon wafer, chip design and manufacturing, module packaging and assembly, and specific lamps. Discussions are also given to the ultra-scalable reactor design, material constitutive modeling, and curvature evolution...
Undesired residual stress always exists in light emitting diode (LED) after the process of metalorganic chemical vapor deposition (MOCVD) due to difference in thermal expansion coefficient of different layers, doping, and lattice mismatch. Residual stress would mostly induce defects in the process of LED chips, the packaging, accelerated testing and their applications. The influence of strain/stress...
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