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We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit...
A power supply circuit and an electrical interconnect test method are proposed to detect open defects at interconnects between dies in 3D ICs. The test method is based on the amount of charge injected from the power supply voltage source. It is shown by Spice simulation that resistive open defects whose resistance is greater than 20Ω can be detected with the power supply circuit by the test method.
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