The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The cooling solution is designed to dissipate this power level. But because TDP is not necessarily the maximum power that can be applied, chips are operated with Dynamic Thermal Management (DTM) techniques. To avoid excessive triggers of DTM, usually, system designers also use TDP as power constraint. However, using a single...
The emerging Dark Silicon limitation has led the application designers to carefully consider the available Thermal Design Power (TDP) budgets, hardware resources, and software characteristics. In this paper, we propose a hierarchical scheme for distributing the resources and TDP budget among concurrently executing applications with multi-threaded workloads under throughput constraints. Afterwards,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.