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A nickel layer and a silver bonding layer have been deposited on copper electrodes over flex substrates to improve the bondability and die-shear force performance of chip–flex substrate assemblies when using the thermosonic flip-chip bonding process. For bonding temperature of 200°C, the maximum die-shear force was achieved by combining parameter values of 20.66 W ultrasonic power, 625 gf bonding...
The purpose of this study was to investigate the influence of the nickel layer on the bondability and die-shear force of chips and flex substrates they were assembled using thermosonic flip-chip process. The copper electrodes over the flex substrate that were electroplated with a 0.5Lim-thick nickel layer on the surface of copper film and the silver film was then deposited on the nickel layer to be...
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