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Color shift mechanism of LED lighting is complex due to its much more comprehensive structure, generally composed of LED die, phosphor, silicone, reflector, diffusers, and so on, each of them may contribute to the color shift during operation. This paper proposed a breakdown method for the color shift study and investigation on the LED based luminaire level products. For the downlight investigated...
This work is introducing a multi-physics reliability simulation approach for solid state lighting (SSL) electronic drivers. The purpose of this simulation is to understand the thermal-electrical behaviour of SSL electronic drivers through their lifetime. Once the behaviour of the device during its lifetime is understood, the real cause of the failure can be distinguished and possibly solved. The work...
Mesoscale parameters, which describe the atomic interactions of the polymer-metal interface at the separation process, are important in the development of a coarse grain model for the interfacial adhesion study. A non-equilibrium molecular dynamics model is established to obtain the traction-displacement relations of the separation of epoxy-copper interfaces. We study three influencing parameters...
This paper presents a new method for breaking down a low-power power electronics device into its constructed parts used for reliability study of the device. The exceptional feature of this new method is to break down the device into two main parts: function elements and packaging elements. This method can help for a much better prioritizing the failures in the device, and also with having more structured...
Solid state lighting (SSL) is a new lighting technology based on high brightness light emitting diodes (LED). This technology because of being much more energy efficient, having longer lifetime and design flexibility has attracted the attention of both manufacturers and consumers. This technology looks very promising because of its advantages with respect to conventional lighting systems. Especially...
An increasing number of semiconductor companies have research programs related to MEMS products. This can be explained by the wide variety of application areas for MEMS, some mechanical MEMS examples are: filters, oscillators, pressure sensors, particle detection, thermometers and gyroscopes. Many mechanical MEMS operate in vacuum and sealing of the cavity can be obtained by using a wafer level thin...
ITRS has predicted that integrated chip (IC) packages will have interconnections with I/O pitch of 90 nm by the year 2018. Lead-based solder materials in flip chip technology will not be able to satisfy the thermal mechanical requirement these fine pitches. Of all the known interconnect technologies, nanostructure interconnects such as nanocrystalline Cu are the most promising technology to meet the...
This paper presents our effort to predict the system reliability of Solid State Lighting (SSL) applications. A SSL system is composed of a LED engine with micro-electronic driver(s) that supplies power to the optic design. Knowledge of system level reliability is not only a challenging scientific exercise but it is also crucial for successful adoption of future SSL systems. Currently, the lifetime...
The traction-displacement relations of the epoxy-copper interfaces are studied using an atomistic model. The reaction force of the epoxy layer in response to displacement of the interface is calculated during molecular dynamics simulation. A parametric study in terms of displacement rate and the step size of displacement increment has been performed. The traction-displacement relations are found sensitive...
To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be developed. In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds...
Portable electronic products are getting popular during last decade. One of the most common failures for a mobile device is related to the accidental drop impact during daily usage. In this paper, responses data of PCB were measured during drop impact; loading features are analyzed with response data; actual drop tests were carried out to obtained actual drop failure data; failure analyses were conducted...
In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.
In this paper, an investigation on the reliability issues of the packages for high temperature applications is presented. First, experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was...
An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning...
Interface delamination is one of the most important issues in the microelectronic packaging industry. Silver filled die attach is a typical adhesive used between the die and copper die pad for its improved heat dissipation capacity. Delamination between die attach and die pad will severely impact the heat conduction and result in product failure. In order to predict this delamination, interface properties...
Summary form only given. The ever increasing complexity and function integration of microelectronic products in combination with the decreasing design margins, the decreasing time-to-market, and ever increasing gap between technology advance and fundamental knowledge opposes a severe challenge for the microelectronics industry to meet the quality, robustness, and reliability requirements of their...
Loosening of implants in bone is commonly associated with a development of fibrous interface tissues, due to interface gaps and a lack of mechanical stability. It has been postulated that the differentiation of these tissues to fibrocartilage or bone is governed by mechanical stimuli. The objective of our research is to unravel these relationships to the extent that the question whether an implant...
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