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Organic land chip carrier (OLCC) has long been used for package of CMOS sensors. Typically, OLCC packages are developed in structure, using materials such as organic substrate; UV epoxy, silver paste and antireflection coating (ARC) filter. These packages are able to pass MSL-3 at 260degC test and work well with current red light laser applications. However, this design now has been challenged by...
Producing products with multiple quality characteristics is always one of the concerns for an advanced manufacturing system. To assure product quality, finite manufacturing resources (i.e., process workstations and inspection stations) could be available and employed. The manufacturing resource allocation problem then occurs, therefore, process planning and inspection planning should be performed...
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