Search results for: Ja-Myeong Koo
Advanced Materials > 32 > 21 > n/a - n/a
Advanced Materials > 32 > 21 > n/a - n/a
Microelectronics Reliability > 2008 > 48 > 11-12 > 1857-1863
Journal of Alloys and Compounds > 2008 > 466 > 1-2 > 73-79
International Journal of Adhesion and Adhesives > 2008 > 28 > 6 > 314-320
Journal of Alloys and Compounds > 2008 > 458 > 1-2 > 253-260
Materials Science & Engineering A > 2008 > 483-484 > Complete > 254-257
Materials Science & Engineering A > 2008 > 483-484 > Complete > 620-624
Journal of Electronic Materials > 2008 > 37 > 1 > 118-124
Microelectronics Reliability > 2007 > 47 > 12 > 2169-2178
Microelectronic Engineering > 2007 > 84 > 11 > 2686-2690
Scripta Materialia > 2007 > 56 > 8 > 661-664
Microsystem Technologies > 2007 > 13 > 11-12 > 1567-1573
Microsystem Technologies > 2007 > 13 > 11-12 > 1463-1469
Microelectronic Engineering > 2005 > 82 > 3-4 > 569-574
Journal of Electronic Materials > 2005 > 34 > 12 > 1565-1572
Journal of Electronic Materials > 2004 > 33 > 10 > 1190-1199