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An atmosphere pressure sensor is developed using SOI (silicon on insulator) wafer based on MEMS technology. In this sensor, the device layer of SOI wafer is etched as the stress detection resistor. And the depth of pressure cavity is controlled by wet etching time. The whole chip is finished by anodic bonding with SOI wafer and pyrex 7740 glass wafer. Also, a kind of plastic packaging for pressure...
In this paper, we mainly present a group physiological monitoring system, called GPMSwLF, which is coupled with a location subsystem. GPMSwLF is based on 802.15.4 wireless network and comprises three kinds of devices: Coordinator, Relay Point (RP) and Physiological Monitor (PM). Coordinator establishes and maintains a wireless network and serves as an interface between GPMSwLF and PC. RP extends the...
In this paper, a kind of plastic packaging for a MEMS pressure sensor is introduced. The materials and parameters of the packaging are selected and optimized to reduce additional stresses from packaging system so as to improve stability of the device. The packaging system is designed according to dimensions and functions of a kind of silicon piezoresistive pressure sensor. We choose silicon rubber...
We developed and tested the Institute of Electronics, Chinese Academy of Sciences (IECAS) 3AHcare node, a health monitoring device capable of measuring a subject's ECG, blood pressure, blood oxygenation, respiration, temperature and motion - almost equivalent to the feature set of a hospital bedside patient monitor. The main contribution of this paper include: the device has been a highly integrated...
We present a novel and practical micro weather station, which can sense temperature, relative humidity, pressure and anemometer, and is portable in small size and possesses high precisions. The micro weather station comprises multi-sensor chip, anemometer, measurement system, display system and power management system. Based on MEMS technology, multi-sensor chip integrated temperature, relative humidity...
We present an advantageous fabrication technology for the integration of pressure sensor into the multi-sensor for micro weather station. Differing from traditional silicon piezoresistive or capacitive pressure sensor, we use platinum piezoresistive pressure sensor in the integration, which can greatly simplify the whole process and also has an excellent performance. We also use adhesive bonding with...
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