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In this study, the impact of plasma stress during TSV (Through Silicon Via) formation process on the device characteristics is investigated. In the TSV formation process, there are several plasma assisted processes such as etching, metal/insulator deposition, ashing and so on, and the devices are exposed to the ambient plasma during these processes. To evaluate the plasma damage, we prepared TEG (Test...
This paper describes the new wafer level packaging process with the diced chip array on the small-diameter handling wafer. The general purpose of wafer level packaging is to realize a smaller, more functional and cost effective electronic package. For example, Wafer Level chip size package and Wafer stacking 3D package are the most effective packaging processes/structures using semiconductor wafer...
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