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In power packages, the DC test for RDS(ON), AC test for various parameters, test for fusing current capability, and unclamped inductive load (UIL) or unclamped inductive switching (UIS) test, are important and critical for assurance of the robust product performance, quality and reliability. The fusing current capability test tries to simulate which case has the highest fusing current capability....
Handheld electronic products are more prone to being dropped during their lifetime of use. Therefore, the reliability performance of these products during a drop impact has become a concern. Although a new board level test method has been standardized through JEDEC (JESD22-B111). characterization tests are usually expensive and time consuming to complete. In order to reduce costs and the design cycle,...
Wire bonding is the most critical process in package assembly manufacturing. Among the wire bond-related failure mechanisms wedge bond heel crack is quite common and critical in the semiconductor industry. This paper focuses on enhancing the robustness of Al wire wedge bond heel in D-PAK under the reliability test of temperature cycling. The Al wire wedge bond shape can be approximately described...
This paper focuses on improvement and prevention of gold wire neck crack for a microoptocoupler. This is a common industry problem, which often induce quality and reliability issues. The DOE simulations which include different thickness of gel, different Young's modulus and CTE of both gel and EMC are considered. TMCL simulation through FE code Ansysreg is conducted to evaluate the influence of various...
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