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Comparing with the single-chip power packages, the power modules usually have a much larger size due to multiple die built inside. This may induce quite a big package warpage in the assembly process, especially after molding, which makes the package warpage big impact on the DBC substrate, as well as on the silicon die when mounting the power module to an external heat sink during application. Therefore,...
A new type of full thermal parametric model for power wafer level chip scale package (WL-CSP) is developed in this paper, which includes parametric WL-CSP and its adaptive parametric JEDEC thermal test board. By employment of the parametric model, package geometry parameters and the trace layout for PCB can easily be changed to meet the requirement of design, so that the influence of all geometry...
In this paper, a general finite element analysis (FEA) software ANSYSreg is employed to investigate the influence of heat sink mount process on the package reliability. Different leadframe design and leadframe material options for a power packages are provided for modeling optimization. In simulation, the dynamic procedure of heat sink mounting process is simplified as a qusi static problem. A half...
An undamped inductive loading (UIL) or switching (UIS) test is critical for power MOSFET dice in order to evaluate the device "ruggedness". During UIL testing, die cracking may appear due to electrical overstress (EOS) induced by the power input. A method that combines both FEA and fractography analysis to identify and verify the possibility of die cracking induced by UIL test is presented...
Thermal resistance is sensitive to package structure, package material, thermal test board and ambient conditions. In this paper, a power package (D2PAK), with natural convection is studied. For the thermal test board, the special designed boards called "MINI Pad" board and "One Square Inch" board for power application are employed based on actual thermal testing. A testing procedure...
This paper focuses on improvement and prevention of gold wire neck crack for a microoptocoupler. This is a common industry problem, which often induce quality and reliability issues. The DOE simulations which include different thickness of gel, different Young's modulus and CTE of both gel and EMC are considered. TMCL simulation through FE code Ansysreg is conducted to evaluate the influence of various...
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