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In this paper, the development of large-sized silicon microchannel heat sink (SMHS) packages for high power dissipation microelectronic modules is presented. The microchannel wafer was designed and fabricated through deep reactive ion etching on the 8" (100) wafer, which included 500 microchannels arranged in parallel and each channel possessed a depth of 400mum. The channel wafer was then bonded...
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