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In this paper, the amplitude of random telegraph noise (RTN) in FinFET is studied, comparing with RTN in planar devices. The impacts of intrinsic characteristics in FinFET (channel non-uniformity and quantum confinement) on its RTN amplitude are comprehensively studied, based on the framework of “hole in the inversion layer” (HIL) model and the 3D device simulations. The results indicate that, the...
The reliability variation simulation methodology for advanced integrated circuit (IC) design is presented from an Electronic Design Automation (EDA) perspective. Reliability effects, such as hot carrier injection (HCI) and bias temperature instability (BTI), continue to be one of major concerns when devices scale down to smaller sizes. Reliability variability, considering process variation (PV) and...
This paper presents a predictive electrostatic capacitance and resistance compact model of multiple gate MOSFET with cylindrical conducting channels, taking into account parasitic effects, quantum confinement and quasi-ballistic effects. The model incorporates the dependence of channel length, gate height and width, gate-to-contact spacing, nanowire size, multiple channels, as well as 1-D ultra-narrow...
In this paper, the effects of nanowire (NW) line-edge roughness (LER) in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) are investigated by 3-D statistical simulation in terms of both performance variation and mean value degradation. A physical model is developed for NW LER induced performance degradation in SNWTs for the first time. The results indicate large performance mean value degradations...
In this paper, the characteristic variability in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) is experimentally studied. Variation sources in SNWTs are extracted for the first time, taking into account the strongly-confined geometry induced quantum effect, quasi-ballistic effects, as well as the parasitic quantum resistance at the interface of 1D channel and 3D wide S/D regions. The measured...
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