The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The root causes of pad cratering may be divided into two categories, namely, overloading induced pad cratering and fatigue induced pad cratering. The former occurs when the interfacial stresses between the epoxy resin and the pad exceed the failure criterion based on the monotonic loading test. The latter happens under cyclic loading conditions, typically with interfacial stresses much lower than...
Post-reflow residual strain is a typical thermo-mechanical phenomenon of printed circuit board assemblies (PCBA) with a large ball grid array (BGA) component after the surface mount process. In general, the post-reflow residual strain may not directly lead to the failure of solder joints, but it may result in a potential risk for another reliability concern, namely, pad cratering. Without sufficient...
De-component is a critical process to either device reuse or rework. This paper investigated the temperature impact on the BGA during the de-component process. The non-uniform temperature was created by special designs of de-component fixtures. The temperature profiles of solder joints were monitored by thermocouples. Plastic ball grid arrays (PBGA) of three package sizes (23×23 mm, 27×27 mm and 35×35...
Many lead-free solder alloys have been proposed as alternatives to the conventional eutectic Sn-37wt%Pb (SnPb). This replacement induces the drop/impact reliability issues of portable products. Under the drop/impact loading, the main failure mode is interfacial brittle failure between lead-free solder joints and intermetallic compound (IMC) layer. The identification of failure mechanism in the solder...
In the present study, a novel computational model is proposed to investigate the plastic strain hardening effect of lead-free solder joints in PCB assembly subject to mechanical drops. The test condition is based on JESD22-B111. The dynamic loading is applied using the popular input-G method. The strain hardening properties of various lead-free solders are experimentally characterized and input to...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.