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An all-fiber twin-core fiber (TCF) fan-out device is proposed and experimentally demonstrated. The device is capable of simultaneously accessing optical signals from both cores for a variety of TCF types. The device was fabricated via bi-tapering of a fiber bundle consisting of two parallel large-core multimode fibers, each of which was tapered-spliced with single mode fibers. A commercial fiber fusion...
As IC technology advances to 16/14 nm and beyond, FinFET architecture with advantage of excellent leakage performance becomes main stream in IC industry. However, it also brings big challenges for integration and processes due to its very aggressive structure and profile, CD shrinkage, shadow effect and gap-fill difficulty. In this work, atomic layer deposition (ALD) metal films, including TaN, TiN...
This paper presents a universal self-aligned in situ on-chip micro tensile fracture strength tester designed for tensile strength extraction and process evaluation, which will provide, for the first time as far as the authors know, great force(above 100mN) to in situ on-chip specimen without the introduction of precise instrument, especially suitable for bulk micromachining related tests. The whole...
With the development of intelligent broadband optical networks, tunable semiconductor lasers are becoming more and more important for wavelength routing and signal processing. A simple and compact widely tunable laser has recently been developed using half-wave coupled V-cavity. The size of the chip is only about 500 µm×300 µm, and the fabrication process is similar to a simple Fabry-Perot laser....
In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence...
In this work, a monolithic integrated MEMS resonator was fabricated and tested. Surface micromachining method was employed to fabricate the cantilever MEMS resonator after a standard 3 µm CMOS process. The wet release method with dilute HF solution was chosen and compared to the anhydrous HF vapor release process. A release-monitoring structure with polysilicon/Au cantilever array was used to determine...
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