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Skew is unintentionally introduced within a differential pair, through misalignment of conductors and glass fiber bundles in Printed Circuit Board (PCB) dielectric layers. Manufacturers do not control interposition of specific glass bundles to supplied board design (artwork). Therefore, an unknown and random factor is added to each produced PCB. Current paper describes a method that utilizes a set...
It is understood very well that at 20Gbps and beyond, P/N skew from fiber weave effect in printed circuit board (PCB) has to be taken into account. Several studies have been done to measure and quantify the effect of glass weave but very few have offered techniques to budget for P/N skew. System companies need an effective way to capture glass weave skew and budget for it in channel designs. Using...
Various PCB edge treatments including via stitching and edge plating connecting ground planes can be employed to suppress the EMI from multilayer printed circuit boards. The shielding performance of these edge treatments is studied in this work. Design curves and an empirical equation are given based on parametric study to summarize the variation of the total radiated power (TRP) as a function of...
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