Search results for: Michael C. Hamilton
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 1940 - 1950
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 7 > 1 - 5
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1598 - 1607
IEEE Transactions on Power Electronics > 2017 > 32 > 9 > 7083 - 7095
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-1 > 1 - 7
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-3 > 1 - 5
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 855 - 861
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-1 > 1 - 4
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 2 > 193 - 200
International Journal of Numerical Modelling: Electronic Networks, Devices... > 29 > 6 > 1161 - 1179
International Journal of Heat and Mass Transfer > 2016 > 97 > C > 94-100
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 5 > 692 - 702
Applied Thermal Engineering > 2016 > 99 > C > 72-79
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 3 > 373 - 382
Microelectronics Reliability > 2015 > 55 > 12(PB) > 2698-2704
Acta Biomaterialia > 2015 > 28 > C > 109-120
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 9 > 1258 - 1264
International Journal of Heat and Mass Transfer > 2015 > 85 > C > 996-1002