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Two novel metamaterial devices including Split Ring Resonator (SRR) modulator and Surface Plasmon Polariton (SPP) interconnect (including SPP T-line and coupler) are proposed with CMOS on-chip integration operated at 140GHz. By introducing sub-wavelength periodical corrugation structure onto T-line, SPP is established to propagate signals with strongly localized surface wave, which results in low...
Free-space EM-wave based GHz interconnect has significant loss and crosstalk that cannot be deployed as low-power and dense I/Os for future network-on-chip (NoC) integration of many-core and memory. This paper proposes an energy-efficient and low-crosstalk sub-THz (0.1T–1T) I/O with use of surface-wave based modulator and interconnects in CMOS. By introducing sub-wavelength periodical corrugation...
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