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Post CMP in-situ cleaning plays a critical role in the yield enhancement at sub 14nm semiconductor manufacturing. CMP in-situ cleaning is conducted in the CMP equipment at post polishing. Typically CMP equipment has a brush scrubber cleaner module to remove post polish byproducts, with the fundamental mechanism of particle removal by using physical force. Therefore, high friction and high contact...
Post CMP in-situ cleaning plays a critical role in the yield enhancement at sub 14nm semiconductor manufacturing. CMP in-situ cleaning is conducted in the CMP equipment at post polishing. Typically CMP equipment has a brush scrubber cleaner module to remove post polish byproducts, with the fundamental mechanism of particle removal by using physical force. Therefore, high friction and high contact...
Post CMP defect is a critical process parameter to yield enhancement and device reliability in sub-14nm semiconductor manufacturing as "killing" particle size has shrunk according to device shrinkage. In order to improve defect at post CMP step, CMP has an in-situ cleaning module, commonly composed of megasonic cleaning, brush scrubber cleanings, fluid jet cleaning and their combination...
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