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Proper power integrity (PI) analysis is required for printed circuit board (PCB) power distribution network (PDN) design. Top-layer interconnect inductance for PI has always been a vital concern for high-speed industry. Developing a simple physics-based equivalent circuit model for critical structures is essential for understanding the physics of the system and for intelligent designs. In this paper,...
In this paper, we propose a coupling model between through silicon via (TSV) and substrate based on a 3-Dimensional transmission line matrix (3D-TLM), which utilizes equivalent lumped circuit model of silicon substrate and TSV. The proposed model is verified by S-parameter simulations using a 3D field solver and analyzed with various structural parameters: TSV diameter, distance between TSV and noise...
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