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This paper describes a systematic approach to design FPGA package for current carrying capability. As we examine silicon, interposer, and package, the profound challenge is found to meet the lifetime of high power device against the greater chance of failures owing to worsen electro-migration in every interconnect level. Our approach consists of practical methodologies to estimate current distribution...
Wire bond packaging for semiconductor devices has been the choice of low cost implementation to memory interface and high-speed transceivers. However, accurate characterization for wire bond package remains challenging owing to lack of consistent probing methodology. Meanwhile, semiconductor devices tend to have increasingly higher density of I/O, logic circuits and transceiver circuits yet shrinking...
This paper presents the dominant contributors of mutual inductance in wire-bond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package...
This paper presents the dominant contributors of mutual inductance in wirebond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package...
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