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This paper describes a systematic approach to design FPGA package for current carrying capability. As we examine silicon, interposer, and package, the profound challenge is found to meet the lifetime of high power device against the greater chance of failures owing to worsen electro-migration in every interconnect level. Our approach consists of practical methodologies to estimate current distribution...
Silicon Interposer with Through Silicon Via (TSV) is a newly developed technology that enables multichip integration and offers great potential to improve system performance with less delay, higher wiring density, and lower power consumption. One challenge of this new technology is to maintain the PDN electrical performance. Micro bumps, TSV, interposer front and back side Re-Distribution Layer (RDL)...
Wire bond packaging for semiconductor devices has been the choice of low cost implementation to memory interface and high-speed transceivers. However, accurate characterization for wire bond package remains challenging owing to lack of consistent probing methodology. Meanwhile, semiconductor devices tend to have increasingly higher density of I/O, logic circuits and transceiver circuits yet shrinking...
This paper addresses various challenges and considerations associated with high-speed serial link designs. As data rates increase, the importance of assessing overall channel performance grows. Silicon-package-board co-design that considers both frequency and time domain budgets is essential for robust implementation capable of accommodating anticipated channel degradation and achieving time-to-market...
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