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In recent years, the requirement of high-end electronic product is higher signal speed, storage capacity and lower power, the bandwidth of package physical design becomes more critical, such as layer count reduction, package routing density. Therefore, there are many electrical validations in a package design, including PDN (Power Distribution Network) and SSN (Simultaneous Switching Noise). In order...
This paper addresses various challenges and considerations associated with high-speed serial link designs. As data rates increase, the importance of assessing overall channel performance grows. Silicon-package-board co-design that considers both frequency and time domain budgets is essential for robust implementation capable of accommodating anticipated channel degradation and achieving time-to-market...
This paper discusses the die-package-PCB co-design methodology and proposes an effective modeling technique for package-PCB co-simulation. This technique accurately takes into account the discontinuities at the package-PCB interface. The proposed new methodology renders the co-simulation 2-5X less time consuming than traditional practice. Based on the new methodology, a multi-layer multi-channel BGA...
In this Paper, we propose a Quick Crosstalk Estimation Methodology by using Crosstalk Superposition Theory. An existing FPGA device package was chosen as the real test case for this study. For both microstrip and stripline, the designs were modeled by using Ansoft SI2D extractor, and the mutual matrix models extracted were used in crosstalk simulation conducted by using Agilent Advance Design System...
This paper presents the dominant contributors of mutual inductance in wirebond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package...
This paper describes a systematic approach to map "black box" s-parameter behavior model into electrically meaningful RLC parameters based on physical layout and impedance transfer function theory. The s-parameter models are from either field solvers or from lab bench VNA measurement".
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