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An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value...
An estimation method of quiescent output voltage of a defective TSV is proposed at which a hard open defect occurs in a 3D IC. The method enables us to reduce the number of times of 3D electromagnetic simulation.
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