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The impact of junction temperature variation between parallel connected SiC Schottky diodes and PiN diodes on the electrothermal ruggedness of the parallel pair have been studied. Parallel connected 600V SiC Schottky diodes and silicon PiN diodes have been subjected to electrothermal stress tests. The electrothermal robustness of the parallel connected pair have been studied as a function of 3 parameters:...
Condition monitoring in power electronics is critical for operational management and control in the context of prolonging the life of the power converter. This becomes even more critical in large complex systems like grid connected voltage source converters for HVDC systems. The common failure modes in power modules based on DBC substrate technology include solder pad delamination and wire-bond lift-off...
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