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In this paper, we present a variational electromagnetic-semiconductor coupled solver to assess the impacts of process variations on the 3D integrated circuit (3D IC) on-chip structures. The solver employs the finite volume method (FVM) to handle a system of equation considering both the full-wave electromagnetic effects and semiconductor effects. With a smart geometrical variation model for the FVM...
This paper presents a novel approach which uses brain computer interface (BCI) technology to translate the user's mental conditions, especially the attention state, into game control. Leveraging on BCI engine to measure a user's attention level to control a virtual hand's movement and utilizing 3D animation technique, the proposed system is significant for training those who suffering from Attention...
In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable...
In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule...
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