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This paper reports a novel process to fabricate electrostatically-actuated, in-plane micromechanical resonators made of fused quartz for high-Q microsensor applications. Two key processes - low temperature plasma-assisted Silicon-on-quartz (SoQ) direct bonding and quartz DRIE using C4F8/He plasma - have been used in combination with thin metallization to fabricate fused quartz resonators driven by...
In this paper, silicon/quartz bonding and quartz deep RIE (DRIE) processes have been developed to fabricate micromechanical quartz resonator structures. A low temperature (< 300degC), plasma-assisted silicon/quartz bonding condition that can provide the maximum bonding shear strength of 10 MPa has been experimentally constructed. The bonded silicon wafer was first applied to an etch mask of quartz,...
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