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A bus-connected tactile sensor system composed of MEMS-CMOS integrated force sensors was developed. A capacitance-to-digital convertor for force sensing, a data reduction processor and a serial bus communication controller are implemented by a laboratory-designed ASIC (Application Specific Integrated Circuit). These functions enable the tactile sensor to be connected with a serial bus cable, and to...
This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40°C/+150°C, 30 min/30 min) by diaphragm method. The width of seal rings necessary...
We have developed a wafer-level packaging solution for surface acoustic wave devices using imprinted dry film resist (DFR). The packaging process involves the preparation of an imprinted dry film resist that is aligned and laminated to the device wafer and requires one additional lithography step to define the package outline. Two commercial dry film solutions, SU-8 and TMMF, have been evaluated....
It reports on the exploratory experiment of a hybrid wafer with two or more die wired for each other in this thesis. The cavity is formed to the wafer, and individual die is arranged there (die is MEMS device and LSIs, etc.). The surface of the wafer and the surface of the dies are made smooth with the resin, and flat wiring is done to the electrode pads of individual die by the photolithography technology...
A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The...
This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/degC The probes are first...
This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level, burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/degC. The probes are...
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