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As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip...
In this paper, key challenges for copper (Cu) BSOB wire bonding process and its solutions are discussed. Cu wire bonding is an alternative interconnection technology for gold (Au) wire bonding. Cu wire is attractive because of its cost, electrical and thermo-mechanical properties. BSOB is the short form of bond-stitch-on-ball. It is used on devices that require die-die wire bonding in multi chip modules...
Various Au bonding wires which have different diameters from 25 um to 12 um, and purity of 2N and 4N are used for studying possible problems in ultra fine wire bonding. As wire diameter gets finer, grain size gets finer and portion of <111> direction in wire texture is increased due to high working ratio. Moreover, as wire diameter gets finer, eccentricity of FAB (Free Air Ball) get worse and,...
Guided wave scattering in a plate overlap is investigated by numerical calculations and experimental measurements of transmission and reflection factors from the overlap region. In the numerical study, a hybrid boundary element-finite element method is used to calculate the guided wave scattered field from the overlap region. Transmission and reflection factors are calculated for incident A0 and S0...
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