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In this paper, we investigate different methods and approaches in order to improve the electrical characteristics of Pt/HfOx/TiN ReRAM devices. We discuss the improvement of the ReRAM electrical characteristics after the insertion of a Hf and Ti buffer layer. As a result, the resistance window increases more that 10 times, and the set and reset voltages decrease both in absolute value and variability...
This work presents the co-integration of resistive random access memory crossbars within a 180 nm Read-Write CMOS chip. -based ReRAMs have been fabricated and characterized with materials and process steps compatible with the CMOS Back-End-of-the-Line. Two different strategies, consisting in insertion of an tunnel barrier layer and the design of a dedicated...
This work reports a technique to fabricate ReRAM crossbar arrays co-integrated with fully finished 180nm CMOS technology chips. The proposed integration method enables low-cost ReRAM-CMOS integration and allows the rapid prototyping of complete memory systems. We propose to use W plugs, already present as vias in CMOS technology, as the ReRAM bottom electrodes. The resistance switching layer, WOx,...
In this study, we propose the insertion of an ultrathin Hf layer at the interface between TiN (top electrode) and HfOX (electrolyte), and then studied its effect on the device electrical properties. In order to obtain the desired switching characteristics, the Hf layer thickness must be precisely engineered. The device with optimized Hf layer thickness exhibits better uniformity and lower forming...
This paper presents a read-write design solution for passive ReRAM crossbar memory arrays to overcome the sneak current paths problem. The proposed circuitry includes an auto-calibration feature to overcome the sneak current effects during the READ operation, and a WRITE protocol to minimize the current at each row and column lines. The presented circuit has been designed in 180nm standard CMOS technology...
Field Programmable Gate Arrays (FPGAs) rely heavily on complex routing architectures. The routing structures use programmable switches and account for a significant share in the total area, delay and power consumption numbers. With the ability of being monolithically integrated with CMOS chips, Resistive Random Access Memories (RRAMs) enable highperformance routing architectures through the replacement...
Crystallization properties of the phase change materials GeSbxTe and GexSb2Te were studied. For GeSbxTe we found that for large x = 6 the crystallization was very fast but crystallization temperature was low while for small x = 1 crystallization was slow but crystallization temperature was high. An alloy with a good compromise between crystallization time and temperature can be found at x = 4.6, with...
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