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An impregnated pancake coil is composed of a $\hbox{REBa}_{2}\hbox{Cu}_{3}\hbox{O}_{7-\delta} $ (REBCO) -coated conductor, a polyimide tape, and epoxy resin, so that a radial thermal stress is generated in the winding by their anisotropic thermal contraction when the coil is cooled from room temperature to 77 K or less. If this radial stress locally exceeds the delamination strength of the REBCO-coated...
TDDB-lifetime distribution of asymmetric pattern (perpendicular-faced comb) was estimated using a 3-dimensional electrostatic model calculation and its statistical treatment based on the percolation theory. Nanometer-size small cells which represent the minimum unit of electric isolation are placed along the perimeter of an asymmetric pattern. In the model, a dielectric breakdown occurs when a series...
Time-dependent dielectric breakdown (TDDB) was investigated, noting the time variation of stress-induce leakage current (SILC) between copper (Cu) lines. To clarify the TDDB mechanism, triangular voltage sweep (TVS) and bias temperature aging were alternatively performed for Cu damascene structures. The SILC was largely increased with stress time; however no Cu ion peak was detected in TVS measurements...
The electric field and temperature dependencies of time-dependent dielectric breakdown (TDDB) degradation in Cu/low-k damascene structures are investigated using Cu/SiOC and Cu/SiCN damascene structures. A field-dependent activation energy analysis of TDDB lifetimes demonstrates that there are multiple TDDB degradation mechanisms for a Cu/SiOC structure and that the dominant TDDB degradation mechanism...
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