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With the development of the integrated circuits, the electronic devices become smaller and smaller, higher density within, and more and more function. The through silicon via (TSV) is the core to the three-dimensional integrated circuit. This paper focuses on the effect to the transmission characteristic of the Ground-Signal-Ground (GSG) TSV. Effects of design parameters, co-simulation with CPW, equivalent...
With the development of the integrated circuits, there is an inevitable trend in the development of the electronics industry, that the electronic devices become much smaller in shape, and integrated with higher density within, and more and more functionality. 3D SIP (System in Package) has become the mainstream technology for the microsystem integration. Meanwhile, the through silicon via (TSV) is...
With the development of the integrated circuits, there is an inevitable trend in the development of the electronics industry, that the electronic devices become much smaller in shape, and integrated with higher density within, and more and more functionality. 3D SIP (System in Package) has become the mainstream technology for the microsystem integration. Meanwhile, the through silicon via (TSV) is...
With the development of the integrated circuits, the electronic devices become smaller and smaller, higher density within, and more and more function. The through silicon via (TSV) is the core to the three-dimensional integrated circuit. This paper focuses on the effect to the transmission characteristic of the Ground-Signal-Ground (GSG) TSV. Effects of design parameters, co-simulation with CPW, equivalent...
This paper focuses on the effect to the transmission characteristic of the hollow TSV. Three parts will be figured out to make it around using the high frequency structure simulator: first, the variation of radius and length of the hollow portion; second, the change of the position of hollow portion; the last, the effect to the transmission performance while the hollow portion is filled with different...
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